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  june 2012 ? 2012 fairchild semiconductor corporation www.fairchildsemi.com FPF1504 ? rev. 1.0.0 FPF1504 ? advanced load management switch FPF1504 advanced load management switch features ? 1.0v to 3.6v input vo ltage operating range ? typical r ds(on) : - 15m ? at v in =3.3v - 20m ? at v in =1.8v - 55m ? at v in =1.0v ? slew rate control with t r : 130s ? output discharge function ? low <1a quiescent current at v on =v in ? esd protected: 4000v hbm, 2000v cdm ? gpio/cmos-compatible enable circuitry applications ? mobile devices and smart phones ? portable media devices ? digital cameras ? advanced notebook, umpc, and mid ? portable medical devices ? gps and navigation equipment description the FPF1504 is a low-r ds p-channel mosfet load switch of the intellimax? family. integrated slew-rate control prevents excessive inrush current from the supply rails with capacitive loads common in power applications. in addition, the FPF1504 features output discharge capability. the input voltage range operates from 1.0v to 3.6v to fulfill today's mobile device supply requirements. switch control is by a logic input (on pin) capable of interfacing directly with low-voltage cmos control signals and gpios in embedded processors. figure 1. block diagram ordering information part number part marking switch (typical) at 1.8v in input buffer output discharge on pin activity t r package FPF1504 g4 20m ? cmos yes active high 130s 4-ball, wafer-level chip- scale package (wlcsp), 1.0 x 1.0mm, 0.5mm pitch
? 2012 fairchild semiconductor corporation www.fairchildsemi.com FPF1504 ? rev. 1.0.0 2 FPF1504 ? advanced load management switch application diagram figure 2. typical application notes: 1. c in =1 ? f, x5r, 0603, for example murata grm185r60j105ke26. 2. c out =1 ? f, x5r, 0805, for example murata grm216r61a105ka01. pin configurations figure 3. 1 x 1mm wlcsp bumps facing down figure 4. 1 x 1mm wlcsp bumps facing up figure 5. pin assignments (top view) figure 6. pin assignments (bottom view) pin definitions pin # name description a1 v out switch output a2 v in supply input; input to the power switch b1 gnd ground b2 on on/off contro l, active high a1 a2 b1 b2 v out on v i n gnd a2 a1 b2 b1 v in gnd v out on fpf 1504 v in g nd v out on off on c in c out t o load
? 2012 fairchild semiconductor corporation www.fairchildsemi.com FPF1504 ? rev. 1.0.0 9 FPF1504 ? advanced load management switch physical dimensions figure 25. 4-ball, 1.0 x 1.0mm wafer-le vel chip scale (wlcsp) packaging product-specific dimensions product d e x y FPF1504ucx 960m 30m 960m 30m 0.230mm 0.230mm package drawings are provided as a service to customers consi dering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawi ng and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packagi ng area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . bottom view side views top view recommended land pattern (nsmd pad type) notes: a. no jedec registration applies. b. dimensions are in millimeters. c. dimensions and tolerances per asme y14.5m, 1994. d. datum c is defined by the spherical crowns of the balls. e. package nominal height is 582 microns 43 microns (539-625 microns). f. for dimensions d, e, x, and y see product datasheet. g. drawing filename: mkt-uc004abrev2. 2x pin a1 area 0.03 c e d a b 2x 0.03 c 0.05 c 0.625 0.539 c 0.3320.018 0.2500.025 seating plane d f f 0.06 c 1 2 a b 0.005 cab 0.50 0.50 ?0.3150.025 4x (y)0.018 (x)0.018 (?0.250) cu pad (?0.350) solder mask 0.50 0.50
? 2012 fairchild semiconductor corporation www.fairchildsemi.com FPF1504 ? rev. 1.0.0 10 FPF1504 ? advanced load management switch


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